What is aluminum Nitride? Aluminum nitride AIN crystal exhibits a wurtzite structure and is a hexagonal system that contains a tetrahedral-covalent bond compound. Chemical composition AI 65.81% and N 34.19%. Specific gravity 3.261g/cm3, white-colored transparent single crystals, sublimation temperature of 2450 under atmospheric pressure. It is a heat and high temperature resistant material. Aluminum nitride can resist molten aluminium, other molten metallics and gallium arsenide.
Performance index for aluminum nitride
(1) The thermal conductivity is high (about 320W/m*K), which is close to SiC. It is more than 5x higher than Al2O3
(2) Matching the thermal expansion coefficient (4.5x10-6), Si (3.54x10-6), and GaAs (6x10-6).
(3) various electrical properties (dielectric constant, dielectric loss, body resistivity, dielectric strength) excellent;
(4) The mechanical properties of BeO and Al2O3 ceramics are superior to their flexural strength. They can also be atmospheric sintered.
(5) Good optical transmission properties;
(6) non-toxic.

Application to nano aluminum nitride within thermal conductive materials
1, Thermal conductive Silica Gel and Thermal conductive Ethyl Resin
Nano AlN composite silica Gel with high thermal conductivity is extremely efficient. It has excellent thermal conductivity, good insulation, low consistency, and excellent construction performance. These products can replace or exceed imported products, and are used extensively in electronic devices heat transfer medium, improving work efficiency. For example, filling the gap between CPU and radiator, high power transistor, silicon-controlled components, diodes, as well as the substrate in direct contact with the thin seam heat exchange medium. Nano thermal paste is used to close the gap between IC/audion and heatsink, increase their contact area, and achieve better heat dissipation.

2, thermal conductive plastics application:
Powders of nano aluminum nitride can significantly improve the thermal conductivity. By adding the experimental product to plastic in a 5-10% ratio, the plastic's thermal conductivity can be increased from 0.33 to 5. Thermal conductivity rose by 16 times. The thermal conductivity additive on the market today has more advantages than this one. It can be used to improve the mechanical properties and the thermal conductivity effect, as well as reduce the amount of thermal conductivity filler. Current nano aluminum Nitride powders have been purchased by relevant manufacturers on a large scale. Then, new nano thermally conductive plastics will go on the market.

3. Other areas of application:
Nano aluminum is used for smelting nonferrous metals, semiconductor gallium arsenide, crucible, evaporationboat, thermocouple protectiontube, heat insulation and microwave dielectric materials. The current application and PI resin are also available.

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